拥有专业化的制程工艺队伍，完善健全的工艺管理制度，确保精工打造每个产品的每个工序。从产品的研发，量产到售后均有专业的工艺人员专注可制造性及后期可靠性保障的研究工作。从接收客户产品资料开始，我们实施针对性的工艺评估，量身定制其每个生产工序的生产工艺从印刷参数的设定，贴装精度的保证，回流焊接的考量，元件焊点外观检验到电器性能的保障，全面覆盖每一个产品。
与时俱进，紧密追踪电子行业最新组装技术的发展，成功实现了通孔回流焊接技术，倒装芯片的可靠性焊接技术，0201微小元件焊接技术，堆叠封装新型元件焊接技术等新工艺技术的导入。先进精良的专业分析、实验设备；EDX ROHS分析仪，X射线检测机、高低温实验机等。可实现对产品失效的准确分析及可靠推移，为客户提供全面专业的解决方案。
Special technical team and completed technic management system ensure every process of product is perfect. Special technician pay attention on study work of product manufacturability and reliability through design to after service; Once get datasheet of product, we will carry out production preparation, setting parameters of every process including solder printing, component placement, reflow and solder joint inspection.
To advance with the times, following the development of PCBA technology, SCUD carry out through hole component reflow, flip chip IC soldering, 0201 component soldering. Advanced analysis equipment like EDX ROHS tester, X-RAY inspector assist NG products research, and solve problem quickly.
图一
图二